top of page

SEAMLESS TRANSITION TO 200MM PROCESSING

Ready to simplify your transition from 150mm to 200mm wafer processing?

Delaying your transition to 200mm wafer processing could lead to

increased operational costs, reduced efficiency, and significant competitive

disadvantage in a rapidly evolving semiconductor industry.


Maximize Your Fab's Potential
with the Analogee 200D

The Analogege 200D System is engineered to eliminate the bottlenecks of 200mm transitions. By combining precision automation with a high-speed SCARA interface, we help you achieve faster cycles and higher yields without the typical growing pains.

  • Dual-Bridge Versatility: Native 150mm and 200mm compatibility for a risk-free transition.

  • High throughput: Integrated SCARA robotics minimize wafer handling time.

  • Precision Surface Prep: Advanced descum and controlled resist removal for superior quality.

  • Maximum Yield, Minimum Space: A compact, space-saving footprint designed for high-density cleanrooms.

  • Industry-Leading ROI: Engineered for the lowest total cost of ownership (TCO) in its class.

200 System Left View_edited
200 Descum Process
200 Uniformity

ANALOGEE 200D SYSTEM SOFTWARE

software

APPLICATION NOTES

Access our technical notes and research papers designed to help engineers and professionals better understand semiconductor processing. Download and review our detailed documents anytime.

Plasma Descum Process Guide

Detailed overview of resist removal techniques for 150mm & 200mm wafers.

First Wafer Affect

Process Contamination From Atmospheric Moisture

bottom of page